The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2001

Filed:

Jan. 10, 2000
Applicant:
Inventors:

Kenkichi Suzuki, Chiba, JP;

Tetsuya Nagata, Ibaraki, JP;

Michiko Takahashi, Chiba, JP;

Masakazu Saito, Chiba, JP;

Toshio Ogino, Chiba, JP;

Masanobu Miyano, Fukuoka, JP;

Assignee:

Hitachi, LTD, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/904 ; H01L 3/1036 ;
U.S. Cl.
CPC ...
H01L 2/904 ; H01L 3/1036 ;
Abstract

A semiconductor device has a thin film transistor including an insulating substrate, an island made of a polycrystalline semiconductor material and disposed on the insulating substrate, a conductive layer made of the polycrystalline semiconductor material and at least one of metals and metallic silicides and surrounding the island, a source region and a drain region spaced from the source region, the source region and the drain region being formed in said island, a gate electrode disposed on the island with an insulating film interposed between the island and the gate electrode, the gate facing a spacing between the source region and the drain region. The polycrystalline semiconductor material forming the island and the conductive layer are fabricated by initially annealing a first amorphous semiconductor material deposited on the insulating substrate with a crystallization-inducing layer made of the at least one of metals and metallic silicides and having a hole corresponding to the island, the crystallization-inducing layer being disposed on a surface of the amorphous semiconductor material on at least one of a substrate side thereof and a side thereof opposite from the substrate side, and then by depositing a second amorphous semiconductor material on the first amorphous semiconductor and annealing the second amorphous semiconductor material.


Find Patent Forward Citations

Loading…