The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2001
Filed:
Jun. 20, 2000
Takanori Kitaura, Tateyama, JP;
Nippon Steel Semiconductor Corporation, Tateyama, JP;
Abstract
A semiconductor device of this invention has an LOC (Lead On Chip) structure, and a protective film consisting of a thermoplastic (thermosetting) resin material such as a thermoplastic (thermosetting) polyimide resin or a thermoplastic (thermosetting) polyamide resin is formed on the surface of a semiconductor chip having a DRAM. The lower surface of a lead frame is positioned to the upper surface of the semiconductor chip, on which the protective film is formed, and the upper surface of the semiconductor chip is bonded and fixed to the lower surface of the distal end portion of an inner lead with only the protective film interposed therebetween such that bonding pads appear between opposing bus bars. According to this invention, the protective film serves not only as an &agr;-ray protective film but also as an insulating material and an adhesive material. Since the semiconductor chip and the inner leads are fixed with a very simple arrangement, the manufacturing process can be largely simplified, and the number of processes can be reduced.