The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2001
Filed:
Jun. 28, 1999
Kenneth Kitlas, San Jose, CA (US);
Anita Patel, Palo Alto, CA (US);
Satyanarayana Nishtala, Cupertino, CA (US);
Alan Lee Winick, San Jose, CA (US);
Alan Lam, Fremont, CA (US);
Winiie C. Leung, San Francisco, CA (US);
Kenneth A. Lown, Sunnyvale, CA (US);
Mohammed Tantoush, Union City, CA (US);
Sun Microsystems, Inc., Palo Alto, CA (US);
Abstract
A computer system housing where a vertical printed circuit board, e.g., a riser card, is inserted into a socket on a computer system motherboard. Some internal space within the housing may allow optimization of system memory capacity through packing of additional memory modules on the riser card. The additional memory may be mounted on the riser card and may reside in the vertical space created between the riser card and the directly-mounted memory on the motherboard. The computer system housing further includes a chassis that may be partitioned into two separate sub-chassis for proper positioning of one or more cooling fans as well as to accommodate changes in computer system configurations with minimized retooling of the chassis. The cooling fans may be mounted at such locations on the chassis that allow optimization of air circulation and, hence, cooling within the housing. However, extra cooling fan(s) for the additional memory on the riser card may not be necessary in view of the creation of dedicated cooling channels within the housing by an efficient placement of the cooling fans. The optimization of fan placement within the housing results in efficient cooling of various system components and allows for increase in system component packing density without a similar increase in the number of cooling fans.