The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2001

Filed:

Dec. 15, 1998
Applicant:
Inventors:

Michio Horiuchi, Nagano, JP;

Toshiaki Suyama, Nagano, JP;

Masakuni Tokita, Nagano, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H06R 9/09 ; H05K 1/09 ;
U.S. Cl.
CPC ...
H06R 9/09 ; H05K 1/09 ;
Abstract

A wiring board has vias which penetrate the wiring board from one side to the other side. The vias are radially arranged in the direction from one side to the other side so that the interval between the vias on one side can be made smaller than the interval between the vias on the other side. In order to prevent the vias from being electrically short-circuited to each other, even if the interval between the vias provided on one side of the wiring board is extremely reduced, a plurality of vias are radially arranged in the direction from one side of the wiring board to the other side so that an interval between the vias on one side of the wiring board can be made smaller than interval of the vias on the other side. A conductor forming the core portion of the via is coated with a sheath portion made of insulating material.


Find Patent Forward Citations

Horiuchi, Michio. (2001). Wiring board having vias (U.S. Patent No. 6271483). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6271483

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…