The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2001

Filed:

Dec. 27, 1999
Applicant:
Inventors:

Tak Hyun Yoon, Chungcheongbuk-do, KR;

Wouns Yang, Chungcheongbuk-do, KR;

Sang Jun Choi, Chungcheongbuk-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/14763 ;
U.S. Cl.
CPC ...
H01L 2/14763 ;
Abstract

Method for forming a wiring in a semiconductor device having a cell array region and a peripheral region, which allows to form a micron pattern below a critical resolution of an exposure, including the steps of (1) forming a conduction layer and a sacrificial wiring layer on a substrate in succession, (2) selectively removing the sacrificial wiring layer to form a virtual wiring line having a sloped end portion, (3) forming sidewall insulating films at sides of the virtual wiring line excluding the sloped end portion, (4) removing the virtual wiring line entirely, (5) forming a mask layer on regions of the pad and peri region pads and other wirings are to be formed thereon, and (6) using the mask layer and the sidewalls in removing the conduction layer selectively, to form a micron pattern.


Find Patent Forward Citations

Yoon, Tak. (2001). Method for forming wiring in semiconductor device (U.S. Patent No. 6271113). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6271113

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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