The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2001

Filed:

Apr. 30, 1999
Applicant:
Inventors:

Steffen Schulze, Wappingers Falls, NY (US);

Franz Zach, Wappingers Falls, NY (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 ;
U.S. Cl.
CPC ...
G03F 7/20 ;
Abstract

The non-uniformity edge effect that can affect the quality of chips near the edge of a semiconductor wafer of various steps in the manufacture of integrated circuits is reduced. This is achieved by increasing the field area exposed by a step and repeat printer only when printing squares for chips located near the wafer edge. As a result there is also printed for processing an additional non-functional area outside the functional area to reduce the non-uniformity effect. This increases throughput of the printing apparatus.


Find Patent Forward Citations

Schulze, Steffen. (2001). Method and apparatus for reducing non-uniformity area effects in the manufacture of semiconductor devices (U.S. Patent No. 6270947). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6270947

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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