The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2001
Filed:
Nov. 18, 1998
Applicant:
Inventors:
Katsuko Yamamoto, Itami, JP;
Takahisa Iguchi, Itami, JP;
Yoshiaki Kumazawa, Itami, JP;
Katsuyuki Tanaka, Itami, JP;
Hiromu Shiomi, Itami, JP;
Takashi Tsuno, Itami, JP;
Naoji Fujimori, Itami, JP;
Assignee:
Sumitomo Electric Industries, Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/160 ;
U.S. Cl.
CPC ...
H01L 2/160 ;
Abstract
A conductive polycrystalline diamond film having specific resistance of at least 1×10,&OHgr;cm and less than,&OHgr;cm, whose film thickness is in the range of at least 0.1 &mgr;m and not more than 500 &mgr;m, is film-formed by vapor-phase synthesis on a surface employed for pressure bonding, a surface opposite to this surface or at least two side surfaces intersecting with these surfaces on a substrate of a bonding tool tip that is applicable for bonding and packaging a semiconductor chip.