The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2001
Filed:
Aug. 16, 1999
Kishor V. Desai, Fremont, CA (US);
Sunil Patel, Los Altos, CA (US);
Ramaswamy Ranganathan, Saratoga, CA (US);
LSI Logic Corporation, Milpitas, CA (US);
Abstract
A semiconductor package is present along with an associated method. The package comprises a substrate with a top surface and a bottom surface, the substrate having a plurality of electrically conductive vias extending from the top surface of the substrate to the bottom surface of the substrate. A semiconductor device having an active surface, the active surface having a plurality of bonding pads, is attached to the substrate by an adhesive that bas holes that align with the vias. The vias are also aligned with the bonding pads. Solder serves to electrically and mechanically couple each of the bonding pads with a corresponding via. Each of the vias, in turn, is coupled to a solder ball formed on the bottom of the substrate.