The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2001

Filed:

May. 13, 1999
Applicant:
Inventors:

Tadashi Fukase, Tokyo, JP;

Masahiro Komuro, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/18242 ;
U.S. Cl.
CPC ...
H01L 2/18242 ;
Abstract

In a method of manufacturing a semiconductor device, MOS transistors are formed on a semiconductor substrate. Each of the MOS transistors includes impurity diffusion regions and a gate electrode. A first interlayer insulating film is deposited over the MOS transistors. Contact holes are opened in the first interlayer insulating film so as to reach the impurity diffusion regions. A conductor is deposited on an entire surface of the semiconductor substrate. The deposited conductor is etched back in order to form contact plugs only in the contact holes. Pad portions are formed only on the contact plugs by the use of a selective growth method. A capacitor is formed over the semiconductor substrate so as to be connected to the pad potions via capacitor contacts.


Find Patent Forward Citations

Fukase, Tadashi. (2001). Method of manufacturing a semiconductor device (U.S. Patent No. 6261897). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6261897

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…