The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2001
Filed:
Apr. 02, 1999
Gerald R. Miller, Scottsdale, AZ (US);
Lakshminarayan Viswanathan, Phoenix, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A method for packaging a semiconductor device (,) to form a semiconductor component (,). A die attach material (,) is disposed on a flange (,). A semiconductor chip (,) is bonded to the die attach material (,). After disposing the die attach material (,) on the flange (,), an insulator material (,) is coupled to the flange (,). A leadframe (,) is coupled to the semiconductor chip (,) via a plurality of wirebonds (,). The wirebonds (,) and the semiconductor chip (,) are protected by a lid (,).
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile