The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2001
Filed:
Dec. 23, 1998
Shuuchi Yanagisawa, Tsurugashima, JP;
Takamasa Yoshikawa, Tsurugashima, JP;
Kazuto Sakemura, Tsurugashima, JP;
Atsushi Yoshizawa, Tsurugashima, JP;
Takashi Chuman, Tsurugashima, JP;
Nobuyasu Negishi, Tsurugashima, JP;
Takashi Yamada, Tsurugashima, JP;
Shingo Iwasaki, Tsurugashima, JP;
Hiroshi Ito, Tsurugashima, JP;
Kiyohide Ogasawara, Tsurugashima, JP;
Pioneer Electronic Corporation, Tokyo, JP;
Abstract
An electron emission device based flat panel display apparatus is composed of a pair of a back substrate and an optically transparent front substrate opposing to each other with a vacuum space interposed therebetween, and a plurality of electron emission devices, each of which includes an electron-supply layer made of metal or semiconductor, formed on ohmic electrodes formed on a surface of the back substrate proximate to the vacuum space, an insulator layer formed on the electron-supply layer, and a thin-film metal electrode formed on the insulator layer and facing the vacuum space. The front substrate includes collector electrodes formed on its surface proximate to the vacuum space, fluorescent material layers formed on the collector electrodes, and an image display array composed of a plurality of light emitting elements corresponding to the fluorescent material layers. The electron emission device based flat panel display apparatus also comprises an insulative support member formed on the back substrate and disposed between adjacent ones of the electron emission devices, and a plurality of electrodes, each of which is disposed between adjacent ones of the thin-film metal electrodes and on the insulative support member for electrically connecting the thin-film metal electrodes.