The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2001
Filed:
Aug. 09, 1999
Eulogia A. Niones, Chandler, AZ (US);
Nhun Thun Kham, Chandler, AZ (US);
Ludovico Bancod, Chandler, AZ (US);
Yeon Ho Choi, Seoul, KR;
Sean T. Crowley, Phoenix, AZ (US);
Other;
Abstract
The present invention includes a package for housing an integrated circuit device. The present invention also includes leadframes and methods for making such packages. The package includes an integrated circuit device on a metal die pad. A metal ring is between the die pad and leads and surrounds the die pad. The ring is connected to the die pad by a nonconductive tape. Encapsulant material covers the entire structure. The ring is connected to a lead identified for connection to an external power voltage supply. The ring in turn is connected to a power voltage input pad on the integrated circuit device. The die pad floats, or is connected to a lead that is connected to an external ground voltage. The package is made from a leadframe that has a die pad, a metal ring between the die pad and radiating leads, and a nonconductive tape that connects the ring to the die pad. In one embodiment, the leadframe and package also include a bypass or decoupling capacitor attached between the die pad and the ring.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile