The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2001

Filed:

Apr. 08, 1999
Applicant:
Inventors:

Yezdi Dordi, Palo Alto, CA (US);

Donald J. Olgado, Palo Alto, CA (US);

Ratson Morad, Palo Alto, CA (US);

Peter Hey, Sunnyvale, CA (US);

Mark Denome, San Jose, CA (US);

Michael Sugarman, San Francisco, CA (US);

Mark Lloyd, late of Fremont, CA (US);

Joseph Stevens, San Jose, CA (US);

Dan Marohl, San Jose, CA (US);

Ho Seon Shin, Mountain View, CA (US);

Eugene Ravinovich, Fremont, CA (US);

Robin Cheung, Cupertino, CA (US);

Ashok K. Sinha, Palo Alto, CA (US);

Avi Tepman, Cupertino, CA (US);

Dan Carl, Pleasanton, CA (US);

George Birkmaier, Cupertino, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 1/700 ; C25B 1/500 ; C25B 1/300 ; C25B 9/00 ;
U.S. Cl.
CPC ...
C25D 1/700 ; C25B 1/500 ; C25B 1/300 ; C25B 9/00 ;
Abstract

The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes a spin-rinse-dry (SRD) station disposed between the loading station and the mainframe, a rapid thermal anneal chamber attached to the loading station, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.

Published as:

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