Packaging and interconnection of contact structure

Abstract

A packaging and interconnection for connecting a contact structure to an outer peripheral component with a short signal pass length to achieve a high frequency operation. The packaging and interconnection is formed of a contact structure made of conductive material and formed on a contact substrate, a contact trace formed on the contact substrate and electrically connected to the contact structure at one end, and the other end of the contact trace is provided with a contact pad for establishing packaging and interconnection from an upper surface thereof, a contact target provided at an outer periphery of the contact structure, a conductive lead for electrically connecting an upper surface of the contact pad and the contact target, an elastomer provided under said contact substrate for allowing flexibility in the interconnection and packaging of the contact structure, and a support structure provided between the elastomer and the PCB substrate for supporting the contact structure, contact substrate and elastomer. The contact structure is projected from the contact substrate to a free space to allow free movements of at least a horizontal portion and a contact portion thereof.