The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2001
Filed:
Mar. 08, 1999
Applicant:
Inventor:
Wei Feng Lin, Taipei, TW;
Assignee:
Silicon Integrated Systems Corp., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
A method of arranging staggered bond pads layers for effectively reducing the size of a die. The sizes of different bond pad layers are reduced gradually from the upper layer to the lower layer, while the sizes of traces in different layers are increased from the upper layer to the lower layers. The size of the first layer is specified and determined by the specification of a wire bonder. The reduction of different bond pad layers may be linear or nonlinear.