The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2001

Filed:

Aug. 12, 1998
Applicant:
Inventors:

Hirokazu Takayama, Tokyo, JP;

Toshiyuki Ogawa, Yokohama, JP;

Atsushi Kaneko, Yokohama, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F16J 1/554 ;
U.S. Cl.
CPC ...
F16J 1/554 ;
Abstract

There are disclosed a damper plate for a rotary machine and a method for producing thereof which makes it possible to produce a honeycomb-type damper plate with accurate dimensions and reasonable cost. In the method for producing a damper plate for sealing between a rotating portion and a stationary portion of a rotary machine and cushioning said rotating portion, the damper plate has a plurality of convex portions and concave portions, and a plurality of the convex portions and the concave portions are processed by a superplastic processing method.


Find Patent Forward Citations

Takayama, Hirokazu. (2001). Damper plate and method for producing thereof (U.S. Patent No. 6250643). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6250643

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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