The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2001
Filed:
Aug. 25, 1999
Thomas P. Glenn, Gilbert, AZ (US);
Ankor Technology, Inc., Chandler, AZ (US);
Abstract
Methods for forming packages for housing an integrated circuit device are disclosed. In one embodiment, step,provides a plastic sheet having an adhesive first surface. Step,provides a patterned metal sheet on the first surface of the plastic sheet. The patterned metal sheet includes an array of package sites. Each package site is formed to include a die pad and a plurality of leads around the die pad. Step,places an integrated circuit device on each of the die pads. Step,connects a conductor between the integrated circuit device and the leads of the respective package site. Step,applies an encapsulating material onto the array. Step,hardens the encapsulating material. Step,removes the first plastic sheet. Step,applies solder balls to the exposed surfaces of the leads. Finally, step,separates individual packages from the encapsulated array. The side surfaces of the die pad and leads of the package include a reentrant portion for engaging the encapsulant material and locking the die pad and leads to the package.