The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2001
Filed:
Jul. 27, 2000
Kazuo Sakamoto, Kumamoto, JP;
Shuichi Nagamine, Nishi-Goshi-Machi, JP;
Tokyo Electron Limited, Tokyo, JP;
Abstract
A wafer is held by a wafer holding section, and while a developing solution is supplied onto a top surface of the wafer, the wafer is rotated 180 degrees, whereby performing the heaping of the developing solution on the top surface of the wafer. Thereafter, the rotation of the wafer is stopped, then holding pins are raised to receive the wafer from the wafer holding section, whereby holding the wafer with the wafer being raised above the wafer holding section by the holding pins, and the wafer is left standing for a predetermined time to thereby perform development. In doing as above, the temperature influence exerted on the wafer from the wafer holding section with large heat capacity is prevented, and the temperature distribution of the developing solution within the wafer plane can be prevented from occurring, thus preventing the occurrence of unevenness in the development caused by the temperature difference from occurring and making it possible to perform development processing with uniformity. As a result, when development processing is performed for a substrate, for example, a wafer, uniformity of the processing can be increased.