The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2001
Filed:
Mar. 26, 1998
Applicant:
Inventors:
Yoshiyuki Ishigaki, Hyogo, JP;
Hiroki Honda, Hyogo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/711 ; H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/711 ; H01L 2/348 ;
Abstract
A semiconductor device including a shunt interconnection which operates at higher speed and permits high density integration is provided. In the semiconductor device including the shunt interconnection, a shunt connection region for a word line and a first shunt interconnection including a metal are formed in the memory cell region. In the memory cell region, shunt connection region and shunt interconnection are electrically connected with each other through a word line contact plug formed in a contact hole.