The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2001
Filed:
Jun. 07, 1995
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A method and apparatus for fabricating small form factor semiconductor chips having high temperature resistance, good humidity and chemical resistance and good dielectric properties. The semiconductor chip includes a lead frame (,) attached to an integrated circuit die (,) by a lead-on-chip (LOC) method. Wire bonds (,) are employed to connect the integrated circuit die (,) to conduction leads (,) on the lead frame (,). After the wire bonding process, the surface of the wire bonded integrated circuit is encapsulated with a layer of resin (,) using either a direct dispensing method or by a screen printing method. The encapsulated integrated circuit may then be cured and functionally tested.