The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2001

Filed:

Apr. 16, 1998
Applicant:
Inventors:

Taylor R. Efland, Richardson, TX (US);

R. Travis Summerlin, Parker, TX (US);

Joseph A. Devore, Dallas, TX (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 3/1058 ;
U.S. Cl.
CPC ...
H01L 3/1058 ;
Abstract

An integrated circuit chip (,) may comprise an integrated circuit (,) formed in a semiconductor layer (,). A thermal contact (,) may be formed at a high temperature region of the integrated circuit (,). A thick plated metal layer (,) may be generally isolated from the integrated circuit (,). The thick plated metal layer (,) may include a base (,) and an exposed surface (,) opposite the base (,). The base (,) may be coupled to the thermal contact (,) to receive thermal energy of the high temperature region. The exposed surface (,) may dissipate thermal energy received by the thick plated metal layer (,).


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