The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2001
Filed:
Apr. 20, 1999
Che-Hoo Ng, San Martin, CA (US);
Matthew S. Buynoski, Palo Alto, CA (US);
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
Chemical mechanical polishing for removing a hardened surface layer of photoresist in the manufacture of semiconductor devices. The use of chemical mechanical polishing allows for the removal of a hardened surface layer of photoresist that has been hardened through ion beam implantation or plasma etching. The chemical mechanical polishing process places a semiconductor wafer with a photoresist layer on a polishing pad. The photoresist layer is placed close to the polishing pad, so that the hardened surface layer of the photoresist layer is removed. A slurry is added to the polishing pad to aid in the removal of the hardened surface layer of the photoresist layer. Conventional chemical stripping is then used to remove the remaining photoresist layer.