The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2001

Filed:

Aug. 24, 1999
Applicant:
Inventors:

Lucien J. Bissey, Boise, ID (US);

Bryan C. Carson, Meridian, ID (US);

Gordon D. Roberts, Meridian, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract

Methods of processing semiconductor circuits are disclosed. In one embodiment, a method of processing a semiconductor circuit includes isolating a conductive region of the semiconductor circuit from a substrate region of the semiconductor circuit while forming the semiconductor circuit, and connecting the conductive region to the substrate region after the forming of the semiconductor circuit is completed. In alternate embodiments, the isolating and connecting of the conductive and substrate regions may include de-activating and activating a transistor, respectively.


Find Patent Forward Citations

Bissey, Lucien. (2001). Method and apparatus for isolating a conductive region from a substrate during manufacture of an integrated circuit and connected to the substrate after manufacture (U.S. Patent No. 6235622). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6235622

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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