The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2001
Filed:
Mar. 17, 1999
Applicant:
Inventors:
Naotaka Tanaka, Ibaraki-ken, JP;
Akihiro Yaguchi, Ibaraki-ken, JP;
Ryuji Kohno, Ibaraki-ken, JP;
Kiyomi Kojima, Ibaraki-ken, JP;
Takeshi Terasaki, Ibaraki-ken, JP;
Hideo Miura, Koshigaya, JP;
Junichi Arita, Musashimurayama, JP;
Chikako Imura, Higashiyamato, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/3495 ; H01L 2/352 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/3495 ; H01L 2/352 ;
Abstract
A TSOP type semiconductor device having a LOC structure employing a copper (alloy) type frame prevents resin cracks that occur in a reliability test such as a temperature cycle test. The TSOP type semiconductor device has narrower common inner leads where a resin crack would be likely to occur first, and has a thinner chip.