The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2001
Filed:
Jun. 07, 1999
Applicant:
Inventors:
Kiyotaka Tsukada, Ogaki, JP;
Masaru Takada, Ogaki, JP;
Mitsuhiro Kondo, Ogaki, JP;
Hiroyuki Kobayashi, Ogaki, JP;
Assignee:
Ibiden Co. Ltd., Gifu-ken, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 ; H05K 1/00 ;
U.S. Cl.
CPC ...
B32B 3/00 ; H05K 1/00 ;
Abstract
A printed wiring board which has a conductor circuit (,) on an insulating substrate (,) and a surface insulating layer (,) formed on the surface of the substrate (,) including the surface of the conductor circuit (,). Part of the conductor circuit (,) has an exposed conductor section (,) having an exposed surface, and a surface insulating layer (,) around the conductor section (,) forms a recessed section at the same level of the surface of the conductor section (,) or lower than the surface. It is preferable to form a black or white solder resist layer on the surface insulating layer.