The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2001
Filed:
May. 04, 1998
Applicant:
Inventors:
Sung-Hun Chi, Seoul, KR;
Jae-Hee Ha, Cheongju, KR;
Assignee:
Hyundai Electronics Industries Co., Ltd., Ichon, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
A plug forming method for a semiconductor device includes the steps of forming an insulation layer in a semiconductor substrate, forming an opening on a predetermined surface portion of the semiconductor substrate, forming a polysilicon layer on the insulation layer including the opening, and etching back the polysilicon layer using a compound gas mixed by a first gas including fluorine, and a second gas including one selected from nitrogen and oxygen. The method decreases the etching loading effect and the plug loss, thereby improving the reliability of the semiconductor device.