The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2001
Filed:
Dec. 03, 1998
Hirofumi Ishida, Kanagawa, JP;
Electroplating Engineers of Japan Limited, Kanagawa, JP;
Abstract
It is an object of the present invention to provide a technology capable of plating satisfactorily even when wafers with a seed metal is plated in sequence by utilizing a cup-type plating apparatus. Plating solution adhered on a support,is removed between an initial and a subsequent plating processes by a cleaning apparatus,for a support,on a cup-type plating tank. The cleaning apparatus,comprises a first arm,of which distal end is positionable at the center of an upper portion of an opening of a plating tank,, and a second aim,which is mounted at one end thereof to the distal end of the first arm,, is provided at the other end thereof with a cleaner,and is pivotal about the distal end of the first arm