Combined process chamber with multi-positionable pedestal

Abstract

A process chamber within which a wafer can moved between a transfer position, an etch position and a liquid application position with a single motion system. The process chamber is a spin-type apparatus including a rotatable chuck driven by a spin motor combined with a movable pedestal. The pedestal is preferably movable along with the chuck and the spin motor with a wafer supporting portion of the chuck located in an internal chamber that is defined by a rinse bowl portion of a lower chamber assembly that is sealingly connected to the top cover member. The pedestal is displaceable between any and all of its positions as driven by a single linear motion driving device. In a first position, the pedestal itself can also form an effective seal with the top cover member to create an etching chamber. In a transfer position, the pedestal can be positioned to provide access through a wafer transfer gate, such as by a robot. In a liquid application position, the chuck supports a wafer within a rinse bowl section of the internal chamber. The process chamber eliminates any need for opening and closing the internal process chamber by moving the top cover member. The method of processing a wafer utilizing the apparatus of the present invention is also described.