The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2001
Filed:
Jul. 02, 1999
Other;
Abstract
An integrated circuit (IC) fabrication method is provided for fabricating a conductive plug, such as a contact plug or a via plug, with a low junction resistance in an integrated circuit. This method is characterized by the inclusion of a preliminary doping process to form a doped region in the exposed area through the contact opening or via opening. By conventional method, the exposed area would be formed with an undesired oxide layer or laid with undesired reactant remnants after the etching process for forming the contact opening or via opening. When being subjected to a high temperature during the subsequent deposition process, the dopant atoms in the doped region diffuse into these undesired insulative matters, thereby reducing the junction resistance of the resulting contact or via plug.