The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2001
Filed:
Mar. 15, 1999
Applicant:
Inventors:
Mikio Nakamura, Kosyoku, JP;
Takahiro Kida, Kosyoku, JP;
Assignee:
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 7/22 ;
U.S. Cl.
CPC ...
B24B 7/22 ;
Abstract
A method for polishing a thin plate including holding the thin plate on a front surface of a holding plate, and moving the thin plate and a polishing pad relative to each other while pressing the thin plate against the polishing pad and supplying a polishing slurry between them. The holding plate is composed of ceramic. The front surface of the holding plate has been previously polished.
Nakamura, Mikio. (2001). Method for polishing thin plate and plate for holding thin plate (U.S. Patent No. 6217417). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6217417
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile