The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2001
Filed:
Nov. 24, 1998
Yoshiro Nakata, Kyoto, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A probe card for wafer-level measurement comprises a plurality of bump electrodes arranged in two dimensions and a multilayer wiring board electrically connected to the bump electrodes. The multilayer wiring board has a multilayer ceramic board and a thin-film wiring layer formed by a lithographic technique. The thin-film wiring layer comprises a plurality of pads, each of which include: a via contact region for contact with a via electrode at the surface of the multilayer ceramic board; a bump contact region for contact with at least one of the probe electrode; and a lead region for providing a connection between the via contact region and the bump contact region.