The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2001
Filed:
Dec. 22, 1999
United Microelectronics Corp., Hsinchu, TW;
Abstract
A wafer level IC structure and a method of manufacturing this wafer level IC structure are proposed, which can help increase the yield of the IC manufacture. The wafer level IC structure is constructed on a semiconductor wafer which is defined into a plurality of discrete IC blocks on the wafer, each IC block being used to form a plurality of IC components such as memory cells. A multi-layer interconnect structure is formed to electrically interconnect these IC components in each of the IC blocks. A first testing and repair process is then perform to disconnect any inoperative IC components from active use. This completes the fabrication stage of the manufacture process. In the subsequent packaging stage, a redistribution line structure is formed to interconnect the discrete IC blocks into an integral functional unit. A second testing and repair process is then perform to disconnect any inoperative IC blocks from active use. The overall IC manufacture would have an increased yield as compared to the prior art.