The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2001

Filed:

Sep. 06, 1996
Applicant:
Inventors:

Elke Zakel, Berlin, DE;

Frank Ansorge, Berlin, DE;

Paul Kasulke, Berlin, DE;

Andreas Ostmann, Berlin, DE;

Rolf Aschenbrenner, Berlin, DE;

Lothar Dietrich, Berlin, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1331 ;
U.S. Cl.
CPC ...
H01L 2/1331 ;
Abstract

Method and apparatus for the testing of substrates which are provided with a wiring structure, in particular, chips (,), in conjunction with which, by means of a solder-deposit carrier (,) which is provided with a structured, electrically conductive coating (,) with bond pads (,) for the arranging of solder deposits (,) and their transfer to correspondingly arranged bond pads (,) of a substrate (,), an electrical check of the wiring structure of the substrate (,) takes place during the transfer of the solder deposits (,).


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