The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2001
Filed:
Jan. 27, 1998
Nasser Barabi, Lafayette, CA (US);
Siamak Jonaidi, San Jose, CA (US);
Cerprobe Corporation, Hayward, CA (US);
Abstract
An improved probe tip for making electrical contact with a solder ball of an integrated circuit device such as a BGA includes two perimeter point structures having interior angled edges which form a front hollow region in the probe tip for receiving the solder ball of a BGA. Each of the interior edges of the point structures includes an angled medial contact zone which tangentially contacts the solder ball received in the hollow region of the tip to produce minimal distortion of the solder ball. The method of the invention permits electrical contact with a solder ball of a BGA with minimal deformation of the solder ball. In accordance with the method, the contact between the probe tip and the solder ball is limited to tangential contacts around the solder ball below the solder ball's apex.