The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2001
Filed:
Sep. 02, 1998
Hiroshi Ichikawa, Yuuki-gun, JP;
Shogo Inada, Yuuki-gun, JP;
Akira Osada, Yuuki-gun, JP;
Katsuhiko Sato, Yuuki-gun, JP;
Kazuhiro Kawano, Yuuki-gun, JP;
Mitsubishi Materials Corporation, Tokyo, JP;
Abstract
A coated cemented carbide endmill comprises a tungsten carbide based cemented carbide substrate comprising 5-20% Co as a binder phase forming component, optionally 0.1-2% of Cr and/or V as a binder phase forming component, optionally 0.1-5% of one or more of (Ti, Ta, Nb, Zr) C·N as a dispersed phase forming component, and the balance being WC as the dispersed phase forming component and inevitable impurities. The WC has a fine grained structure having an average grain size of 0.1-1.5 &mgr;m, the cemented carbide substrate has a reaction-created surface layer formed on the surface portion thereof which is formed by heating at high temperature and in which Co,W,C is distributed over a thickness of 0.1-2 &mgr;m thereof, and further the substrate has coated layers composed of a Ti compound layer. Optionally, an Al,O,layer is formed thereon with an average layer thickness of 0.5-4.5 &mgr;m, the Ti compound layer being composed of one or more layers of TiC, TiN, TiCN, TiCO, TiNO and TiCNO using MT-CVD and the Al,O,layer is formed using MT-CVD or HT-CVD. The hard-material-coated layers of the endmill have excellent adhesion.