The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2001
Filed:
Mar. 24, 1997
Rajeev Bajaj, Austin, TX (US);
Janos Farkas, Austin, TX (US);
Sung C. Kim, Pflugerville, TX (US);
Jaime Saravia, Round Rock, TX (US);
Motorola Inc., Schaumburg, IL (US);
Abstract
A process of polishing two dissimilar conductive materials deposited on semiconductor device substrate optimizes the polishing of each of the conductive material independently, while utilizing the same polishing equipment for manufacturing efficiency. A tungsten layer (,) and a titanium layer (,) of a semiconductor device substrate (,) are polished using one polisher (,) but two different slurry formulations. The two slurries can be dispensed sequentially onto the same polishing platen (,) from two different urce containers (,and,), wherein the first slurry is dispensed until e tungsten is removed and then the slurry dispense is switched to second slurry for removal of the titanium. In a preferred embodiment, the first slurry composition is a ferric nitrate slurry while the second slurry composition is an oxalic acid slurry.