The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2001
Filed:
Oct. 27, 1999
Kazuto Yonemochi, Nagano, JP;
Masahiro Yonemochi, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
A method for producing a semiconductor device, including the steps of: forming a recess on a first side of a metal substrate; forming a film, made of a metal that is not dissolved by an etchant solution which dissolves the metal substrate, on an inner surface of the recess; punch-pressing a region of the metal substrate that corresponds to an area of the metal film from a second side of the metal substrate so that the area of the metal film formed on the inner surface of the recess becomes substantially flush with the first side of the metal substrate, thereby forming a bonding pad from an extending portion of the metal film that extends from the inner surface of the recess over the first side of the metal substrate; mounting the semiconductor chip on said first side; wire-bonding electrodes of the semiconductor chip and the bonding pads; sealing the first side of the metal substrate that includes the semiconductor chip, the bonding wire and the metal film with resin; and dissolving and removing the metal substrate by etching, thereby exposing the metal film formed on the inner surface of the recess.