Grounding mechanism which maintains a low resistance electrical ground path between a plate electrode and an etch chamber

Abstract

An etch apparatus is presented including a grounding mechanism which maintains a low resistance electrical ground path between a plate electrode and a chamber despite temperature variations. The etch apparatus includes a chamber having a removable upper housing, a plate electrode positioned within the upper housing, and a grounding mechanism positioned between the plate electrode and the upper housing such that it contacts both the plate electrode and the upper housing. The grounding mechanism electrically couples the plate electrode to the upper housing. Several embodiments of the grounding mechanism include at least one sheet of metal folded to form two sections extending in an acute angle relative to one another. In two embodiments, the folded sheet of metal forms two sections meeting at a crease. Each of the two sections has an outer edge opposite the crease. At least one of the two sections is segmented by cutting in a direction perpendicular to the outer edge and the crease to form multiple strips or “fingers” extending outwardly from the crease. In one embodiment, a first of the two sections is substantially flat, and the second section is bowed such that the distance between the two sections is greatest midway between the crease and the outer edge of the second section. A second embodiment includes a cylindrical resilient member positioned between the two sections and parallel to the crease. A third embodiment includes two curved sheets of metal and multiple clamps distributed over the length of the grounding mechanism.