The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2001
Filed:
Jun. 10, 1996
Applicant:
Inventors:
Thomas J. Licata, Lagrangeville, NY (US);
Katsuya Okumura, Poughkeepsie, NY (US);
Kenneth P. Rodbell, Sandy Hook, CT (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
A method of enhancing the aluminum interconnect properties in very fine metalization patterns interconnecting integrated circuits that improves the texture and electromigration resistance of aluminum in thin films. Enhanced performance can be obtained by forming a smooth oxide layer in situ, or by surface conditioning a previously formed oxide layer in an appropriate manner to provide the requisite surface smoothness, then by refining the aluminum microstructure by hot deposition or ex-situ heat treatment.