The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2001
Filed:
Dec. 15, 1999
Syoichi Kobayashi, Nagano, JP;
Naoyuki Koizumi, Nagano, JP;
Osamu Uehara, Nagano, JP;
Hajime Iizuka, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
A semiconductor device excellent in bonding strength of bumps with respective protruded electrodes and having high reliability wherein a wiring pattern,to be connected to an electrode,of a semiconductor chip,is formed on an insulting film,formed on the semiconductor chip,in which the electrode,is formed, protruded electrodes,are formed on the wiring pattern,, the wiring pattern,is covered with a protective film,, and a bump,for external connection is formed on the end portion of each of the protruded electrodes,exposed from the protective film,, the bump,is formed in such a manner that the bump is bonded to the at least entire end face of each of the protruded electrodes