The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2001
Filed:
Jun. 29, 1999
Nobuo Ooyama, Satsuma-gun, JP;
Shinichiro Maki, Satsuma-gun, JP;
Fumitoshi Fujisaki, Satsuma-gun, JP;
Syunichi Kuramoto, Satsuma-gun, JP;
Yukio Saigo, Satsuma-gun, JP;
Yasuo Yatsuda, Satsuma-gun, JP;
Youichi Matae, Satsuma-gun, JP;
Atsushi Yano, Satsuma-gun, JP;
Kazuto Tsuji, Kawasaki, JP;
Masafumi Tetaka, Satsuma-gun, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A semiconductor device and a method of producing the same are provided. The semiconductor device includes: a semiconductor chip; a resin package which seals the semiconductor chip; signal passages which guide the signal terminals of the semiconductor chip outward from the resin package; a grounding metal film in contact with the bottom surface of the semiconductor chip; and a grounding passage which is connected to the grounding metal film and guided outward from the resin package.