The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2001
Filed:
Oct. 07, 1999
Tadashi Maeda, Fukuoka, JP;
Tadahiko Sakai, Fukuoka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A solder bump formation method and solder bump mounting method for forming a solder bump by soldering a solder ball,onto an electrode,provided at the bottom of a cavity,on a substrate,which has an opening shape through which the solder ball,cannot go. Metal paste,containing metal having a higher liquidus temperature than that of solder used for the solder ball,is filled into the cavity,The solder ball,is placed on the cavity,, and then heated to the temperature higher than the liquidus temperature of the solder ball,During the heating process, metal in the metal paste,remains unmelted in the cavity,when the solder ball,melts. This enables the metal to direct the melted solder to the electrode,at the bottom of the cavity,achieving good soldering.