The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2001
Filed:
Jul. 08, 1998
Fumio Miyajima, Togura-machi, JP;
Apic Yamada Corporation, Nagano, JP;
Abstract
The method of resin molding is capable of preventing molded products from forming resin flash on their surfaces. The method comprises the steps of: covering over a parting face, of at least one of molding dies with release film; clamping a work piece, with the release film, by the molding dies; and filling the melted resin in the molding section of the molding die, wherein the release film is tightly pressed on a surface of a part of the work piece, which is exposed after molding, in the clamping step. By pressing the release film on the surface of the part of the work piece, the release film prevents the melted resin from invading into a gap between the release film and the work piece, so that no resin flash is formed on the surface of the work piece.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile