The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2001

Filed:

Oct. 26, 1998
Applicant:
Inventor:

Eckhard Sperschneider, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 2/318 ;
U.S. Cl.
CPC ...
G01N 2/318 ;
Abstract

The invention concerns a process and circuit arrangement for testing solder joints, preferably on printed circuit boards, whereby the quality of the solder joints is examined for defects using X-rays and qualitative information on the individual solder joints is obtained. According to the invention, the qualitative and/or the measured values of the individual solder joints that characterize the measured physical parameters of the tested solder joints, are used to control the manufacture of further solder joints in the production process in which solder joints are tested.


Find Patent Forward Citations

Sperschneider, Eckhard. (2001). Process and circuit arrangement for testing solder joints (U.S. Patent No. 6185273). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6185273

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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