The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2001
Filed:
Jun. 01, 1995
Applicant:
Inventors:
Shigeru Harada, Itami, JP;
Takashi Yamashita, Itami, JP;
Noriaki Fujiki, Itami, JP;
Tsutomu Tanaka, Itami, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1465 ; C23G 1/24 ;
U.S. Cl.
CPC ...
H01L 2/1465 ; C23G 1/24 ;
Abstract
A method and an apparatus for manufacturing a semiconductor integrated circuit in which semiconductor elements (,) and a wiring structure connecting the semiconductor elements (,) one another are located on a semiconductor substrate (,). In the method or apparatus, a series of wiring elements (,), each of which constructs the wiring structure is formed sequentially, then the semiconductor integrated circuit under manufacturing process is washed by neutral solution containing oxidant during the process of forming of the wiring elements (,).