The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2001
Filed:
Jun. 17, 1999
Atsushi Hino, Ibaraki, JP;
Hitoshi Ishizaka, Ibaraki, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
A method is disclosed for removing a decomposition residue and/or a processing residue, of a material of a resin layer, which is attached to the periphery and inside of holes formed in the resin layer of a printed board. The method provides shooting a laser beam having a wavelength for laser ablation at the holes to thereby remove the decomposition residue and/or the processing residue; reshaping the sectional shape perpendicular to the direction of advance of the laser beam by beam reshaping optics; and shooting the reshaped laser beam to shoot simultaneously all the holes formed in the resin layer and vicinity thereof, wherein the total irradiated area on the printed board is 200%-10,000% of the total sectional area of the holes formed in the printed board. Also disclosed is a method for producing a printed board having holes that provides for: forming holes in a resin layer of a printed board by laser processing and removing a decomposition residue and/or a processing residue, of a material of the resin layer, which is attached to the periphery and inside of the holes.