The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2000

Filed:

Dec. 28, 1997
Applicant:
Inventors:

Janet M Flanner, Union City, CA (US);

Linda N Marquez, Fremont, CA (US);

Joel M Cook, Pleasanton, CA (US);

Ian J Morey, San Jose, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438743 ; 438706 ; 438707 ; 438710 ; 438714 ; 438723 ; 438729 ; 438734 ; 438735 ; 438737 ;
Abstract

In a plasma processing chamber, a method for etching through a selected portion of an oxide layer of a wafer's layer stack to create a self-aligned contact opening is described. The wafer stack includes a substrate, a polysilicon layer disposed above the substrate, a nitride layer disposed above said polysilicon layer and the oxide layer disposed above the nitride layer. The method for etching includes etching through the oxide layer of the layer stack with a chemistry and a set of process parameters. The chemistry essentially includes C.sub.2 HF.sub.5 and CH.sub.2 F.sub.2 and the set of process parameters facilitate etching through the oxide layer without creating a spiked etch and etching the oxide layer through to the substrate without substantially damaging the nitride layer.


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