The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2000
Filed:
Jul. 12, 1999
Applicant:
Inventor:
Chin Fong Lee, Singapore, SG;
Assignee:
Chartered Semiconductor Manufacturing Ltd., Singapore, SG;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C / ; C23C / ;
U.S. Cl.
CPC ...
20429815 ; 20429802 ; 20429809 ; 118728 ; 118721 ; 118720 ; 118715 ; 118500 ; 118503 ; 2692 / ; 269903 ;
Abstract
A clamping ring design that eliminates the Wafer sticking problem. In the first embodiment of the present invention the wafer clamp ring is redesigned to sharply reduce the wafer to wafer-ring contact area. In the second embodiment of the present invention a clamp ring guide is added to prolong the lifetime of the clamp ring.
Lee, Chin. (2000). Clamping ring design to reduce wafer sticking problem in metal deposition (U.S. Patent No. 6162336). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6162336
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile