The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2000
Filed:
Jul. 08, 1998
Fred Khosropour, San Jose, CA (US);
Mehdad Mahanpour, Union City, CA (US);
Ahmad Ghaemmaghami, Morgan Hill, CA (US);
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
A system and method for detecting at least one fault in at least one circuit of a flip-chip package is disclosed. The circuit located on a first portion of a semiconductor die. The method and system include the steps of thinning the semiconductor die without destroying the at least one circuit. The method and system further include applying a liquid having a high evaporation rate in a layer on at least a portion of an exposed surface of the semiconductor die after thinning and applying power to the at least one circuit. The method and system also include determining where at least one portion of the liquid has evaporated from the exposed surface of the semiconductor die to detect the at least one fault.