The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2000

Filed:

Nov. 13, 1998
Applicant:
Inventors:

Tim Z Hossain, Austin, TX (US);

William S Brennan, Austin, TX (US);

Berta Valdez, Austin, TX (US);

Renee S Prusik, Austin, TX (US);

Amiya R Ghatak-Roy, Austin, TX (US);

Assignee:

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438660 ; 438795 ;
Abstract

A method of making a semiconductor device to reduce or prevent defects caused by the ejection of deposited material. The method includes a first layer of material deposited over a substrate in the presence of a gaseous ambient. A portion of the gaseous ambient is trapped by the first layer. This entrapped portion could cause defects during subsequent elevated temperature processing as the gas attempts to escape from the first layer. To prevent or reduce this problem, after depositing the first layer and before depositing a second layer over the first layer, the first layer is heated to remove at least a portion of the gaseous ambient trapped in the layer. For best results, the first layer is heated to a temperature at least as high as the highest temperature of later processing steps and at a pressure of no more than 1 torr. This method is particularly useful for layers formed by physical vapor deposition.


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